Components | August 08, 2011

Nanium and 3D Systems Packaging Research Center join forces

Nanium signed an agreement to become a Supply Chain Member of the 3D Systems Packaging Research Center at the Georgia Institute of Technology (GT PRC) Embedded MEMS, Actives and Passives (EMAP) Industry Research Consortium.
The EMAP consortium is a highly successful industry collaboration program that includes companies from around the world. As a Supply Chain Member in the EMAP consortium, Nanium will contribute to the program serving in a Package Integrator capacity for the new technology.

The agreement is the foundation of the partnership, and the co-operation between the GT PRC, the largest academic research center in the field of semiconductor packaging, and Nanium, the largest OSAT in Europe, is another excellent example of the growing global industry collaborations, in which GT PRC discovers new technologies and transfers them, as well as interdisciplinary educated engineers to industry, providing a path for commercialization of System-on-Package (SOP) based technologies, bridging the so-called "Valley of Death" between university research and commercialization.


Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
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