Components | June 16, 2011
STMicro makes 28nm CMOS process available through CMP
The CMOS 28nm process from STMicroelectronics is now available for prototyping to universities, research labs and companies through the silicon brokerage services provided by CMP (Circuits Multi Projets).
The introduction of the 28nm CMOS process builds on the successful collaboration that has allowed universities and companies to access previous CMOS generations such as 45nm (introduced in 2008), 65nm (introduced in 2006), 90nm (introduced in 2004), and 130nm (introduced in 2003). CMP is also offering 65nm and 130nm SOI (Silicon-On-Insulator), as well as 130nm SiGe processes from STMicroelectronics. For example, 170 universities and companies received the design rules and design kits for the 90nm CMOS process, and more than 200 universities and companies (60% in Europe, 40% in Americas and Asia) have now received design rules and design kits for ST’s 65nm bulk and SOI CMOS processes. The 45/40nm CMOS is still being deployed. “There has been a great interest in designing ICs in these processes, with about 300 projects having been designed in 90nm (phased out in 2009), and 200 already in 65nm,” said Bernard Courtois, Director of CMP. “In addition, 60 projects have already been designed in 65nm SOI and it is interesting to note that many top universities in Europe, in the USA and in Asia have taken advantage of the CMP / ST offer.” The CMP multi-project wafer service allows organizations to obtain small quantities--typically from a few tens to a few thousand units--of advanced ICs. The cost of the 28nm CMOS process has been fixed to 15,000 Euros/mm2, with a minimum charge of 1mm2 (Users can order a die area as small as 1mm2). “This very exciting program perfectly illustrates our strong involvement with the education and research communities. It is essential that university students and researchers can have access to the most advanced technologies, which we have been providing in cooperation with CMP for two decades,” said Patrick Cogez, Director, Universities and External Relations, Front-End Technology and Manufacturing at STMicroelectronics. “Ensuring that universities have access to our leading-edge technologies also helps us to attract the best young engineers as part of our commitment to remain a technology leader on a long-term basis.”
Farnell signs new distribution agreement with KOA Farnell says it has strengthen the depth and breadth of its passive component range with the addition of KOA Europe GmbH.
II-VI with domestic and foreign acquisitions Compound semiconductor specialist, II-VI Incorporated, has entered into a definitive agreement to acquire all outstanding shares in Swedish SiC epitaxial wafers specialist, Ascatron AB. At the same time, II-VI says it will acquire all the outstanding interests of the owners of the parent of INNOViON Corporation.
Microsoft invests in AI Chip company Syntiant, a deep learning tech company providing AI voice and sensor solutions, has completed a USD 35 million Series C funding round.
Meyer Burger sells its microwave and plasma maker Muegge Meyer Burger Technology is selling its microwave and plasma technology company Muegge GmbH, to investment company HQ Equita.
ON Semi looking to sell Japanese facility ON Semiconductor is exploring a sale of its manufacturing facility in Niigata, Japan. The intended sale of the facility is part of the company’s plan to optimise its manufacturing footprint and sharpen its focus on highly differentiated power, analog and sensor products.
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.Load more news