Organised by
evertiq
TEC - The Evertiq Conference
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TEC PROGRAM


  • Between 09:00 and 16:00 you are invited to attend our table-top exhibition as well as listen to interesting stage presentations.
  • The stage program will run parallel to the exhibition. Feel free to attend the sessions that you are most interested in.
  • Lunch will be served between 11:00 and 13:00.
  • Beverages and snacks are served in our buffet areas throughout the day.


  • 09:00 - 09:00
    Welcome to TEC Lund 2017
    Evertiq
  • 09:05 - 09:25
    A little something about Forsway's projects in India and Africa
    Mats Andersson - Chairman of the Board - Forsway
    More than half the world's population lacks access to the Internet, mainly in developing countries in Africa and Southeast Asia. But even in the rural areas of Europe, the United States and South America, hundreds of million lacks access to fast (10 Mbps) broadband. Forsway from Skövde, Sweden, has developed a broadband modem that combines the large coverage from TV satellites/TV tower in the downlink with mobile technology in the uplink and is – ans the only company in the world – rolling out 5G, or in other words; Broadband to all, today. So far, the company has delivered over 50’000 modem to customers in all continents except Australia and Antarctica. Currently, efforts are being made with authorities and private actors in India, as well as commercial rollout in, among other places, Congo, Senegal, and Nigeria. Mats will talk about some of Forsway's projects in India and Africa.
  • 09:30 - 10:00
    Building universal test solutions out of intelligent, modular building blocks, in record time
    Peter van Oostrom - Business Development Manager - 6TL Engineering
    6TL Engineering has developed a modular system called fastATE. FastATE enables engineering managers to efficiently build and design functional, ICT, BScan or combinational test systems in any size and for any production needs. In this presentation Peter van Oostrom will show you how 6TL overcame the pitfalls that you will encounter on the road to building a reliable, modular and flexible test solution.
  • 10:05 - 10:35
    3D-MID Prototyping
    Gernot Seeger - General Manager - Beta Layout
    Since electronic devices become smaller and more precise, engineers face the challenge of developing modules that need less space and are lower in weight. The new 3D-MID (mechatronic integrated devices) technology, plastic parts designed with electronic circuits, is a favorable solution and the answer to the requirements of the electronics industry for space-saving modules. Three-dimensional circuit carriers enable engineers to develop multifunctional products with new features and reduced weight. 3D-MIDs are usually produced from injection molded plastic. A new method by using 3D prints instead of molds allows more economic production of MID-prototypes in less time. This presentation covers how 3D-MID prototypes based on laser-sintered 3D prints are manufactured and shows how this technology will be accessible for a broad range of R&D engineers. The presentation will answer questions regarding necessary data, design rules and manufacturing. Conclusion: 3D-MID prototyping will be less expensive and quicker by using 3D printed parts instead of injection-molded parts. By providing an appropriate 3D MID design software and offering a complete prototyping service, this technology also can be used by smaller companies and (independent) R&D engineers.
  • 10:40 - 11:15
    New figures for the Nordic EMS industry
    Peter Brent - Researcher - Reed Electronics Research
  • 11:00 - 13:00
    Lunch
  • 12:50 - 13:30
    EMC Compliance in Motor Drive Applications
    Herbert Blum - Product Manager EMC - Schurter AG
    Technical presentation about EMC compliance in electrical motor drive applications. Explaining general motor drive setup with the different EMC problems that could occur. What causes these EMI noise and showing examples. Showing practical tips to lower the noise and possible filter solutions. A practical measurement example on a motor drive with different filters shows how to find the best solution for a typical application.
  • 13:35 - 14:20
    Live-Demo: Dust Networks – SmartMesh for industrial applications.
    Mats Hellberg - Field Application Engineer - Linear Technology
    Low-power wireless sensor networks for industrial IoT with >99,999% network reliability in tough RF environment. Learn the technology behind SmartMesh network that delivers business-critical data were other RF solutions fails. Live demo of the technology.
  • 14:25 - 14:55
    to be announced
    Johan Dahl - Velocity
  • 15:00 - 15:30
    Assure Reliable Performance of Semiconductors in High Performance Industries
    Yehoshua Shoshan - InnoFour B.V.
    Reliability of semiconductors is impacted by four major wearout mechanisms. However the data for the analysis is not always available and need to be obtained using multiple methods. Here we will give an overview about the IC reliability analysis and the background for a number of erroneous concepts (like MTBF) which are still in wide use.
  • 15:35 - 15:55
    Test for LTE-A, IoT, V2V/V2X and 5G
    Mats Andersson - Vice President Sales and Business Development - Bluetest
    Bluetest, based in Gothenburg, specialises in test solutions for smartphones and other devices with small antennas. Mats is going to base his presentations around test solutions for LTE-A, IoT, V2V/V2X and 5G.
  • 16:00 - 16:00
    Thanks for a succcessful TEC Lund
    Evertiq
”Call for Papers” open for TEC Lund 2017

Evertiq has announced the “Call for Papers” for technical presentations. Technical presentation abstracts – which are sent in prior to August 28, 2017 – will be considered for inclusion.

Prospective presenters are invited to submit abstracts (100 - 150 words). Material must be non-commercial and should detail the nature and scope of the proposed presentation. The abstract should also contain the following presenter contact details: job title, company and e-mail.

Please send the abstract with a short speaker biography by e-mail to , indicating in the subject line of the e-mail: “TEC Lund Call for Papers”.

Contact

Project Manager
Henrik Björsell
+46 70 371 90 09
Sales
Peter Lithander
+46 70 377 99 50
Conference Program
Anke Schröter
+46 73 844 90 09