SUSS receives order from ASE

The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300mm, that will be installed at ASE's wafer level packaging and redistribution process facility in Kaohsiung, Taiwan. "Driven by market demands for faster, smarter, portable and integrated electronic products, we are increasingly moving towards more sophisticated semiconductor applications", said D.Y. Chen, vice president of advanced packaging operations, ASE Kaohsiung. "Therefore, we have to rely on production equipment that enables high yields, coupled with unmatched throughput and cost effectiveness. SUSS MicroTec's product offerings in lithography technology will enhance our success in providing wafer level packaging and wafer bumping services to our customers."