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SMT & Inspection | November 16, 2007

New wafer scale bump inspection system from Lloyd Doyle

Lloyd Doyle announces the release of IBIS-Versalea, a new bump inspection system aimed at silicon wafer bump inspection.
Versalea builds on the IBIS technology released by Lloyd Doyle recently which is a high speed interferometer-based system for solder bump inspection of IC substrates.

IBIS uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspecting and reporting on 3000 bumps per second. The IBIS range now comprises prototype and production size units for substrate inspection in the form of IBIS-lab and IBIS whilst the Versalea will be capable of handling 300mm diameter wafers and all combinations of substrates in panel format.

Lloyd Doyle are a UK-based operation, supplying automatic optical test and inspection equipment to the pcb manufacturing industry. IBIS represents a new product range for the company concentrating on 2D / £d inspection and has already received high accolades from industry leading players.

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