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SMT & Inspection | May 16, 2007

Zestron offers Surface Analysis

Zestron's Analytical Centers now offers evaluation and analytical inspection of assemblies and stencils.
Various test methods for the surface cleanliness analysis of electronic assemblies prior to subsequent coating and bonding processes are readily available. Equipments for ionic contamination, surface tension as well as contact angle measurement are available. Zestron also provides specifically developed quick analytical tests such as the Zestron Flux Test and the Zestron Resin Test. Thus, assemblies can be tested according to international standards (i.e. IPC standards and J-STD 001D).

Additionally, Zestron offers a Coating Reliability Test for the evaluation of the reliability of coatings on electronic assemblies.

In case of field failures, ZESTRON can identify potential failure mechanism by completing climatic storage chamber tests and providing recommendations to further improve board design.

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Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
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October 16 2017 2:56 PM V8.8.6-2