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Electronics Production | March 06, 2007

Freescale put RCP in volume production

Freescale Redistributed Chip Packaging technology moves toward volume production. The technology passes commercial specifications.
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications.

Freescale announced the RCP technology in July 2006. RCP integrates semiconductor packaging as a functional part of the die and system solution. It addresses some of the limitations associated with current generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps while providing an industry-leading solution for scaling package size and thickness.

The technology is applicable to 3G mobile phones and a broad range of consumer, industrial and networking devices that can benefit from the consolidation of electronic components into a single, miniaturized system.

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