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Test & Measurement | March 06, 2007

Cupio to launch new AOI and X-Ray systems

Cupio presents their new YESTech B3 benchtop automated optical inspection system and a new X1 Automated X-Ray Inspection System.
Employing Thin Camera™ technology and designed for populated printed circuit boards, it inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput, the company said in a press release.

The versatile new YESTech X1 automated x-ray inspection (AXI) system from Cupio offers electronics manufacturers a capability to inspect solder joints and critical hidden features found in electronic assemblies and PCBs.

Both sýstems will be introduced into Europe at the Nepcon 2007 exhibition.

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