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Electronics Production | March 15, 2005

Siliconix and ST to cooperate

Siliconix and STMicroelectronics announce license agreement for new double-sided cooling MOSFET packaging technology.
STMicroelectronics and Siliconix incorporated, an 80.4%-owned subsidiary of Vishay Intertechnology, Inc. has announced that the two companies have concluded an agreement whereby ST will license from Siliconix a new power MOSFET packaging technology that provides superior thermal performance via top and bottom heat dissipation paths in systems using forced air cooling.

Offered by Siliconix under the PolarPAK™ name, the new package’s leadframe and plastic encapsulation are similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing. Yet compared with the standard SO-8, the PolarPAK package dissipates heat so efficiently that it can handle twice the current within the same footprint dimensions.

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