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Electronics Production | January 23, 2007

Freescale and IBM enter Alliance

Freescale and IBM in technology alliance for joint semiconductor research and development.
The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.

This agreement brings together Freescale's skills in key embedded markets, including automotive, networking, wireless, industrial and consumer, with IBM's skills in developing technology and systems expertise.

This alliance will enable Freescale to further strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners. The Common Platform provides its semiconductor fabrication partners with synchronized manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.

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