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Electronics Production | January 22, 2007

AMD completes new<br>German test unit

AMD has completed a 20,000m² construction of a Cleanrom, Bump and Test facility, adjacent to Fab 30 in Dresden, Germany.
The added capacity is designed to make more space available in both its front-end fabs at the same location as well as to handle the capacity ramps at Fab 36 and Fab 38, after completion of its conversion from a 200mm fab to a 300mm facility

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