SMT & Inspection |
Datacon to deliver Laurier M9 flip chip die bonder to Finland
Datacon Technology GmbH, has received an order for Laurier M9 ultra-high precision flip-chip die bonder from Finnish VTT.
VTT is an independent research organization in Finland and according to a spokesperson from the organization the Laurier M9 flip-chip die bonder will be used in a broad range of development projects in the realm of opto-electronic, RF and MEMS applications.
