RoHS |
Lead-Free BGA Rework
It's now common knowledge that lead-free solder does not wet surfaces as well as traditional tin-lead solder. Among other consequences, this fact is affecting how assemblers rework ball grid arrays (BGAs).
There are two ways to resolder a BGA on a printed circuit board (PCB) assembly. In one method, the solder balls are placed on dots of solder paste. In the other, the solder balls are placed on dots of liquid or paste flux. The question is: Which works better with lead-free assemblies?
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