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Material | July 27, 2006

Does PCB pad finish affect voiding levels in lead-free assemblies

With European environmental legislation and market forces driving the change to lead-free solders for printed circuit board assembly, there will be significant changes in the soldering process. 'Voiding' is one of the known major consequences of these process changes exaggerated by the use of new soldering materials.
Excessive voiding can lead to poor quality joints, BGA 'popcorning', open-circuit failures during burn-in or thermal cycling; even field failures can be the result. Therefore voiding needs to be minimised to retain process quality and to reduce rejects and returns in the change to lead-free production.

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