Ad
Ad
Ad
Ad
Ad
Ad
Electronics Production | July 21, 2006

Tight supply of flip-chip substrates<br>will continue through end of 2006

In an article in Global SMT Packaging there are reports from TechSearch International that the supply of flip-chip substrates continously will be short at least through 2006.
Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates. Despite many companies have increased their manufacturing capacity the situation is expected to remain much the same through the end of this year.

Approximately 25 weeks or longer are needed for completion of engineering evaluation and qualification of the manufacturing processes.

The situation will though improve in 2007 and 2008 when the companies are catching up with the capacity, according to Global SMT Packaging.

Comments

Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
Ad
Ad
Load more news
December 13 2017 10:15 PM V8.9.2-2