Camtek gets new orders

The systems will be installed during the first quarter of 2016 and will be used for inspection and metrology of advanced packaging applications. Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, “I am happy that our systems are the tool of choice for advanced packaging applications. We have invested great effort supporting the growth of the advanced packaging market segment and are working closely with our customers on improving our systems' performance along with their product yield. With our proven history of results in 3D metrology demonstrated at multiple customers, I am confident that our newly launched capabilities for 2D inspection will gain a significant market share in the short term and become the ultimate tool for 2D inspection and metrology."