Ad
Ad
Ad
Ad
Ad
Ad
© edhar-yralaits-dreamstime.com Electronics Production | May 15, 2014

SUSS MicroTec delivers enhanced coater/developer-system

SUSS MicroTec has recently delivered a newly developed coater/developer tool to an Asian packaging foundry (OSAT).
The system is based on SUSS MicroTec’s ACS300-technology. The ACS300 tool is a modular cluster system designed for clean, reliable and high throughput photolithography applications.

The tool was especially developed to process wafers for Fan-Out Wafer-Level Packaging applications. With this coater/developer system artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL).

"We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,” says Frank P. Averdung, President and CEO of SUSS MicroTec. “Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.”

Comments

Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
Ad
Ad
Ad
Ad
Load more news
February 08 2018 5:15 pm V9.2.4-1