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SMT & Inspection | February 10, 2006

Flomerics Releases New Version of Flo/PCB

Flomerics has released a new version of its Flo/PCB thermal simulation software that will reportedly help solve thermal problems in solder reflow processing associated with lead-free solders.
This version is said to simulate the reflow process and predict the temperatures at any point on the board during the entire reflow process. This allegedly makes it possible to optimize oven settings and thermocouple attachment points prior to a physical profiling run.

To read the full article cleck here.

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