GSPK invests in technology

GSPK Circuits have purchased 2 Burkle Bonding presses and a Cooling press recently to augment its already thriving multi-layer production process. 'This additional Multi-layer Bonding Capacity provides GSPK with the facility to process up to 384 multi-layer panels daily. The cycle-time is optimized which in turn generates high production throughput reducing lead-times. The Bonding system includes a new ML registration system which will enable the manufacture of yet higher technology PCBs with increased layer counts and improved layer to layer registration', a press statement reads.