DEK Galaxy chosen by LORD Corporation

Equipment Pre-applied – also known as wafer-applied – underfill (WAU) systems have garnered much attention. However, to date, few formulations have delivered the performance required to move the process into mainstream semiconductor packaging applications such as wafer-level CSPs and flip-chip technology. “In early development, we were spin coating the WAU onto the wafers, but were getting total thickness variations (TTVs) across the surface that ranged anywhere from 10% to 20%, which was simply unacceptable,” explains Candice Brannen, Senior Scientist at LORD Corporation. “We then engaged DEK’s advanced development group to analyze our materials utilizing a printing process and a 50 micron coating thickness. This combination yielded a surface variation of roughly 3%, which is exceptional”, he continues.