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PCB | May 26, 2009

New cooling technology integrated in PCB

Ulf Andersson Electronics now marketing PCB:s with up to 500 micron copper layer from Zot, which is a unique solution to the problem of heat dissipation and increasing demands of the amperage.
With increasing demands on the printed circuit board for effective heat dissipation and power, Zot has developed a process where two different copper thicknesses coexist on the outer layers at the same printed circuit board. The technology, allowing sophisticated circuitry and power/heat dissipation in the same layer, is known as MCW (Multi Copper Weight).

The technology allows 210 micron innerlayers with 35 microns outerlayers, whith parts of the outerlayer circuitry with very heavy copper eg. 300 microns or more. The heavy copper areas are part of the circuitry, and can have the usual plated holes, plated to the requirements of IPC.



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