Siemens to launch SIPLACE SX
Siemens Electronics Assembly Systems (SEAS) will unveil its new SIPLACE SX placement machine at the SMT/Hybrid/Packaging Show in Nuremberg next week.
The new SIPLACE SX is the first placement machine with full gantry modularity - a new technology that makes line reconfigurations a thing of the past.
Another European premier is the new SIPLACE MultiStar. It is the first placement head that combines Collect & Place and Pick & Place modes and is thus able to process an exceptionally broad component spectrum at maximum speeds.
The new SIPLACE SX delivers a solution for ever-more-frequent product changes and demand fluctuations. It gains additional flexibility from the 12-nozzle SIPLACE MultiStar placement head with CPP (Collect & Pick & Place) technology, which switches automatically to the most efficient placement mode.
Another European premier is the new SIPLACE MultiStar. It is the first placement head that combines Collect & Place and Pick & Place modes and is thus able to process an exceptionally broad component spectrum at maximum speeds.
The new SIPLACE SX delivers a solution for ever-more-frequent product changes and demand fluctuations. It gains additional flexibility from the 12-nozzle SIPLACE MultiStar placement head with CPP (Collect & Pick & Place) technology, which switches automatically to the most efficient placement mode.
Indian joint venture aims at hi-tech cluster
ELCINA, an electronics industry Association in India, and Vittal Innovation City will partner to develop a cluster for electronics component and equipment manufacturing in India.
GPV moves into medical electronics
GPV Asia Electronics has obtained Bureau Veritas’ medical certification ISO 1348.
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