Henkel and Shanghai University in agreement

The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China Headquarters in Shanghai, China. The duration of the Shanghai Region Joint Electronics Research & Failure Analysis Centre project is currently scheduled from April 1, 2008 through March 31, 2011. “Henkel’s significant investment in this project is further proof of our commitment to advance technology, expand the success of this region and promote cost-effective, anticipatory materials solutions to the global electronics industry,” says Henkel’s Dr. Michael Todd.