Aspocomp beefs up its machine park

Tero Päärni, Vice President Sales of Aspocomp comments on the completed installation: " This production line consists of copper surface preparation, photoresist lamination, automated laser direct imaging (LDI) and a new, state of the art develop-etch-strip line (DES). This new configuration is capable of running very thin inner layers, down to 50u and very high density buried and inner layers, down to 50/50µm line /space. This kind of PCB sub-products have become increasingly important when PCBs get more complex and the overall packaging density increases." In addition the new line is expected to further improve Aspocomp’s capability to produce impedance controlled PCB for higher data rates.