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© vladimir melnik dreamstime.com Components | December 19, 2012

UMC with 55nm SDDI customer product tape-out

United Microelectronics has taped out a customer product utilizing 55nm small display driver IC (SDDI) process technology.
Yau Kae Sheu, senior director of UMC's 12-inch Specialty Technology Development division, said, "This world-leading 55nm SDDI process nicely complements our comprehensive display driver technology portfolio. With our volume production 0.13um and our recently introduced new generation 80nm SDDI technologies, customers now have the flexibility to design into a full range of smartphone resolutions depending on their application, including WVGA, qHD, HD720/WXGA, and now Full-HD, fully covering smartphone display requirements from 3.5-inch to larger than 5-inch."

The 55nm SDDI process features an ultra small SRAM size (0.4um2) and provides an ideal balance of power consumption, performance, and chip size for integration into high-end Full-HD smartphones that demand low power and a slim profile. 55nm SDDI customer products will be manufactured using advanced 300mm wafer technology, with fast manufacturing cycle to fit customer time-to-market needs. The 55nm process leverages UMC's world leading position in SDDI, with over 300 million SDDI chips shipped for today's mainstream smartphones.

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