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Components | September 03, 2012

A molded chip scale package

Alpha and Omega Semiconductor Limited (AOS) markets the AOC2403 – claiming to be the industry's first Molded Chip Scale Package (MCSP) in a tiny 0.97mm x 0.97mm x 0.3mm power package.
Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound.

MCSP can easily replace a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. The MCSP encapsulates AOS's low on-resistance MOSFET silicon in a Green (halogen-free) molding compound, which end result is to give it a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products.

"The Molded Chip Scale Package offers an innovative solution to ultra-slim designs while improving the package robustness compared to existing CSP solutions. The innovative package, along with the low on-resistance AOS MOSFET technology, provides designers of ultra-portable systems with a compelling new power management solution," said Peter Wilson, Director of Low Voltage MOSFETs at AOS.

AOC2403 is a 20V 95mOhm P-Channel MOSFET housed in a halogen-fee MCSP. The package dimensions are 0.97mm x 0.97mm x 0.3mm.

Pricing and Availability

The AOC2403 is immediately available in production quantities with a lead-time of 12 weeks. The unit price for 1'000 pieces is USD 0.35.

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